Originally Posted by dukedkt442

Doubtful. There isn’t any more heat emanating from the FPDM than a laptop computer or the engine compartment, and look how much plastic is under there. No engineer worth a salt was thinking minor heat sink and ignoring basic junior high school chemistry. Rubber standoffs belie the heat wicking to steel idea, as does plastic cover; standoffs would actually aid any heat wicking. Aluminum finned case would do better for cooling that flat surface tucked against steel (I’ll have to look up specific heats tomorrow for better info), like the PCM. Good hypothesis though. The FPDM resembles more of a zinc material than aluminum, which if the case makes it even more consumable (but cheap).

Originally Posted by gone postal

Ever feel how hot a CPU gets without a heat sink and fan? There's a reason they liquid cool high end CPUs on gaming machines.

The components in the module need the heat sink for cooling. It would have been far less expensive to mold the entire housing out of plastic than make the base of the housing from aluminum.

Originally Posted by gone postal

Yes, I have, I worked on electronics for a living for 25 years. It all depends on how much BTU transfer it needs to handle. An electronic module like the FPDM which is essentially a modulating circuit for the fuel pump needs some cooling capacity due to the fact that it's modulating power, but doesn't need the severe cooling ability offered by a chip heat sink. The air moving over the module is enough.